PCB & SMT

Specification:

• Layer: 4L

• Board Thickness: 1. 6mm

• Surface Treatment: Electroplated Gold 5u"

Specification:

• Layer: 10L

• Board Thickness: 1. 6mm

• Surface Treatment: Chemical Gold 3u"

Specification:

• Layer: 12L

• Board Thickness:1. 4mm

• Surface Treatment: Chemical Gold 3u"

Specification:

• Layer : 48L

• Board size(inch) : 22.898 " × 16.898 "

• Material: Megtron6

• Finish thickness : 6.35 mm

• Laminate (Megtron6) : 12oz “ THK

• Process type : Immersion Gold (5u")

• Fabrication : CNC +

• Via in pad : Epoxy

• Min. hole size: 0.3 mm

• Impedance control: Yes

FPC SMT

• Layer: 2L

• Material: EMI, SUS Reinforcement, Impedance

FPC

• Layer: 2L

• Material: FR-4 Reinforcement,One pcs

SMT